PCB Design Engineer

The ideal candidate has extensive experience designing complex multilayer PCBs with high-speed digital interfaces, precision analog circuitry, image sensors, FPGAs, power electronics, and EMI/EMC best practices.

Key Responsibilities:

• Design multilayer PCBs for high-performance imaging systems and camera electronics.
• Develop PCB layouts from schematics through manufacturing release.
• Collaborate with electrical engineers to optimize component placement and routing.
• Design boards incorporating FPGAs, DDR3/DDR4/LPDDR memory, CMOS image sensors, ADCs/DACs, ARM processors, power supplies, and precision analog front ends.
• Perform high-speed signal integrity layout for interfaces including DDR, USB 3.x, PCI Express, Gigabit Ethernet, Camera Link, CoaXPress, MIPI CSI-2, and LVDS.
• Develop camera hardware platforms, including schematic capture and PCB layout for sensor interfaces, power regulation, timing control, and data transmission.
• Develop controlled-impedance stack-ups with PCB fabricators.
• Ensure compliance with EMI/EMC, thermal, manufacturability, and reliability requirements.
• Bring up and debug new hardware using oscilloscopes, logic analyzers, and protocol analyzers.
• Document designs and interface specifications and support hardware validation and production.

Required Qualifications:

• B.S. or M.S. in Electrical Engineering, Computer Engineering, or related field.
• 5+ years of camera PCB design experience.
• Expert knowledge of PCB CAD tools such as Altium Designer, Cadence Allegro, or OrCAD PCB Designer.
• Experience designing complex multilayer boards (8–20+ layers).
• Strong understanding of controlled-impedance routing, differential pairs, high-speed timing constraints, return-current paths, and crosstalk reduction.

Desired Qualifications:

• Experience interfacing with visible and IR image sensors.
• Understanding of power regulation, analog/digital separation, and signal integrity.
• Experience with multilayer PCB layout, high-speed digital and mixed-signal design, controlled-impedance routing, differential-pair matching, power integrity, signal integrity, EMI/EMC mitigation, and thermal analysis.

Success Metrics:

• Deliver PCB layouts on schedule with minimal design revisions.
• Achieve first-pass fabrication success and reduce board re-spins through robust design practices and reviews.
• Meet signal integrity, EMI/EMC, thermal, and reliability targets.
• Successfully support prototype bring-up and transition to production.
• Develop and maintain standardized PCB libraries and layout guidelines.
• Improve design efficiency through reusable practices and documentation.
• Ensure designs support manufacturability (DFM), assembly (DFA), and testability (DFT).